References

MDP and MD-PICTS were originally developed at the Technische Universität Bergakademie Freiberg, Germany. There is a large variety of different semiconductors and dielectric materials that have been investigated over the years. Most of the work is protected by disclosure agreements. However there are a number of different publications that can be studied for more detailed informations.

selected Publications:

  • K. Niemietz, K. Dornich, M. Gosh, A. Müller, J.R. Niklas
    Contactless investigation of electrical properties and defect spectroscopy of mc-Si at low injection level
    21st European Photovoltaic Solar Energy Conference, in press

  • K. Dornich, K. Niemietz, Mt. Wagner, J.R. Niklas
    Contact less electrical defect characterisation of silicon by MD-PICTS
    Material Science in Semiconductor Processing, Elsevier, 241-245

  • S. Hahn, K. Dornich, T. Hahn, A. Köhler, J.R. Niklas, P. Schwesig, G. Müller
    Contact free defect investigation of wafer annealed SI InP
    Material Science in Semiconductor Processing 9, Elsevier, 355-358

  • thesis: K. Dornich (German)
    Elektrische Charakterisierung und Defektanalytik von Silizium mit MDP und MD - PICTS
    Institut für Experimentelle Physik Freiberg, 2006

  • thesis: B. Gründig-Wendrock (German)
    Mikrowellendetektierte Photoleitung und PICTS- Methodik und Anwendung auf GaAs
    Institut für Experimentelle Physik Freiberg, 2005

  • K. Dornich, T.Hahn, J.R. Niklas
    Non destructive electrical defect characterisation and topography of silicon wafers and epitaxial layers
    Mater. Res. Soc. Symp. Proc. Vol. 864, 2005 MRS

  • S. Hahn, T. Hahn, K. Dornich, B. Gruendig - Wendrock, J.R. Niklas, P. Schwesig, G. Müller
    Contact free defect investigation in as grown Fe doped SI - InP
    Mater. Res. Soc. Symp. Proc. Vol. 864, 2005 MRS

  • B. Gruendig - Wendrock, K. Dornich, T.Hahn, U. Kretzer and J.R. Niklas
    Contact-free investigation of the EL2-defect in the surface of GaAs wafers
    Eur. Phys. J. Appl. Phys., Vol. 27 (2004), No. 1-3, p. 363-366